BCD半導(dǎo)體發(fā)布新型低電壓型運(yùn)算放大器AZV321

    日前，BCD半導(dǎo)體（BCD Semiconductor Manufacturing Limited）宣布推出一款低電壓運(yùn)算放大器AZV321，AZV321是一款單路微功耗軌至軌輸入/輸出運(yùn)算放大器。超寬的電源電壓范圍可以滿足低電壓應(yīng)用的各種需求。這一放大器具有優(yōu)秀的快速功率比, 在低電壓電流時(shí)可達(dá)到1MHz的帶寬和 1V/µs 的上升速率。AZV321放大器的設(shè)計(jì)可以完全滿足要向更低電源電壓遷移的高速設(shè)計(jì)方案需求，它適用于主動式濾波器，低功率, 低電壓應(yīng)用，通用手持設(shè)備，蜂窩電話, 無繩電話以及電池供電系統(tǒng)。 

    AZV321 采用 先進(jìn)的BiCMOS 工藝制造。它有雙極輸入輸出級, 改善了噪聲性能, 實(shí)現(xiàn)了低輸入失調(diào)和更高的輸出電流驅(qū)動。它也允許設(shè)計(jì)師把器件放在更接近信號源的地方, 減少噪聲拾取并增加信號的完整性。

此外它還具有以下特點(diǎn)：

工作電壓2.7V 到 5.5V ；
無交越失真 ；
增益帶寬積 1MHz；
低電源電流：130µA；
在 10kΩ負(fù)載下的軌至軌輸出擺幅；
VOH 最高到 VCC - 10mV； VOL 接近 VEE +65mV；VCM：- 0.2V 到 VCC-0.8V

    AZV321適用于-40°C 到 85°C 的工業(yè)溫度范圍，不但提供標(biāo)準(zhǔn)的SOT-23-5封裝, 還提供大小只有SOT-23-5封裝的一半的 SC70-5封裝。小封裝可以節(jié)省印刷電路板的空間, 從而可用于手持式便攜電子設(shè)備的設(shè)計(jì)。

附：原文

BCD Semi (BCD Semiconductor Manufacturing Limited) has recently announced a new low voltage operational amplifier AZV321. AZV321 is a single supply low voltage (2.7-5.5V) op amp which has the rail-to-rail output swing capability and a wide common-mode input voltage range down to ground. The chip exhibits excellent speed-power ratio, achieving 1MHz bandwidth and 1V/µs slew rate with low supply current. AZV321 is most suitable for low power, low voltage applications, such as battery powered portable device, MP3/4 player, cellular phone, and cordless phone.

The AZV321 is built with BiCMOS process. It has bipolar input and output stages for improved noise performance, low input offset and higher output current drive.

Features:
（For VCC=5V and VEE=0V, Typical unless Otherwise Noted）
• Guaranteed 2.7V to 5.5V Performance.
• No Crossover Distortion
• Gain-Bandwidth Product 1MHz
• Industrial Temperature Range: -40℃ to +85℃
• Low Supply Current: 130µA
• Rail-to-Rail Output Swing under 10kΩ Load:
VOH up to VCC -10mV
VOL near to VEE +65mV
• VCM: -0.2V to VCC-0.8V

AZV321 is available in standard SOT-23-5 package as well as SC70-5 package. The SC70-5 package is approximately half the size of SOT-23-5. The small package saves space on PCBs, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.